New sensing method measures laser-cutting depth by tracking vaporization recoil
Laser dicing, a technique that uses focused laser pulses to separate individual chips from a semiconductor wafer, is increasingly favored over mechanical blade cutting because it can process delicate, low-strength materials with minimal physical stress. However, achieving proper yield requires preci...
Image: Phys.org
Laser dicing, a technique that uses focused laser pulses to separate individual chips from a semiconductor wafer, is increasingly favored over mechanical blade cutting because it can process delicate, low-strength materials with minimal physical stress. However, achieving proper yield requires precise control over the process.
Originally published at Phys.org
