Highly filled liquid epoxy for smaller, more reliable chip packaging
As computer chips become more powerful and compact, the materials that protect them must perform better than ever. In advanced chip packaging, liquid epoxy is widely used because it can flow into tiny spaces before curing into a solid protective layer. To be effective, the material must be easy to p...
Image: Phys.org
As computer chips become more powerful and compact, the materials that protect them must perform better than ever. In advanced chip packaging, liquid epoxy is widely used because it can flow into tiny spaces before curing into a solid protective layer. To be effective, the material must be easy to process in its liquid state while becoming strong, stable and reliable after curing.
Originally published at Phys.org
